What we cook in kitchen hardware for 2014?
Quick look at the near future of computer processors, memory, graphics technology and interfaces
He's gone next year, we saw loads of innovative and interesting computer devices. But there is no place for nostalgia, because the new 2014 and promises to be just as rich in all sorts of gadgets and technology. As might be expected, the eyes of the world are confined mostly to the mobile segment, where in recent years happen and the most curious things, such as the mass occurrence of relatively accessible "smart watches" or the famous smart glasses like Google Glass, whose market debut will look forward to this year, where the most pronounced technological mantra are likely to be called. wearable devices (handheld devices). However, they will have only a drop in the sea of new technological solutions that will flood us in waves in 2014. Therefore, there is no way to cover a material in all that can be expected in high-tech segment during the year. But we can at least review the basics - what is going to happen in the good old world of computer technology, although with its more modern incarnations mobile. It will try to do in the next rows, summarize the plans of major technology giants and peep into hardware "kitchen" where they prepare the new computer processors, memory, next-generation technology and impressive graphics faster interfaces.
Processors and hybrid computing chips
It makes sense to start with what we can expect soon - before the end of January should occur hybrid processors AMD next generation, called Kaveri. As you may know, the main feature of the fourth generation of hybrid processors AMD's new "heterogeneous architecture" HAS, in this case version 2.0. In essence, this architecture provides configuration including CPU (two modules Steamroller) and GPU (graphics eight blocks - a total of 512 stream processors - Radeon architecture GSN 1.1). CPU and GPU blocks interact through technology hUMA (heterogeneous unified memory), which gives them access to a shared pool of system memory and, more importantly, the ability to retrieve the results of calculations directly from memory without any additional intermediate copies. This, AMD enables computational process to exclude a large number of unnecessary intermediate steps, which, of course, should significantly improve the performance.
According to the design of AMD architecture HSA 2.0 should significantly ease the process of data processing everyday tasks in graphical blocks, but it all again depends on the software developers using heterogeneous computing. To motivate developers, AMD promising tools (including compiler Linux GCC / HSA), which will accelerate their work on this model. Another question is how many developers will tend to use them to optimize their programs with them. It should be noted, however, that the HAS is an open standard that can be used by ARM processors. According to experts, however, the imposition and consolidation of this standard will probably take years.
Beginning, however, be laid at least two chips Kaveri: 4-core processors A10-7850K and A10-7700K. The flagship chip Kaveri A10-7850K has 4 cores (two modules architecture Steamroller), standard operating frequency 3,7 GHz (and up to 4 GHz in Turbo Core 3.0 mode). Moreover, this chip has 4 MB of L2 cache and an integrated graphics processor (GPU) with 512 stream processors, 8 raster units and 32 texture units (8 GCN module). All it will spend up to 95 W power. The smaller chip Kaveri A10-7700K will have 4 cores architecture Steamroller, but they will run on 3,5 GHz (3,7 GHz and in Turbo Core 3.0 mode), and the same amount (4 MB) cache L2. GPU section of this chip will have 384 stream processors, 6 modules for rasterization and 24 texture units (GCN 6 modules). It is expected that this decision is 65 W or 95 W consumption.
Beginning, however, be laid at least two chips Kaveri: 4-core processors A10-7850K and A10-7700K. The flagship chip Kaveri A10-7850K has 4 cores (two modules architecture Steamroller), standard operating frequency 3,7 GHz (and up to 4 GHz in Turbo Core 3.0 mode). Moreover, this chip has 4 MB of L2 cache and an integrated graphics processor (GPU) with 512 stream processors, 8 raster units and 32 texture units (8 GCN module). All it will spend up to 95 W power. The smaller chip Kaveri A10-7700K will have 4 cores architecture Steamroller, but they will run on 3,5 GHz (3,7 GHz and in Turbo Core 3.0 mode), and the same amount (4 MB) cache L2. GPU section of this chip will have 384 stream processors, 6 modules for rasterization and 24 texture units (GCN 6 modules). It is expected that this decision is 65 W or 95 W consumption.
2014 will be a year of 64-bit mobile processors
A bunch of new 64-bit mobile processors based on ARM architecture will debut on the market next year, informed online resource DigiTimes. According to the newspaper is sure evidence that Qualcomm, NVIDIA and Broadcom intend to launch quad-core mobile processors with 64-bit architecture in the first half of 2014
Earlier last year, plans to launch smartphone 64-bit processors in 2014 announced the Samsung, though without specifying exactly when, but rather the production of 64-bit ARM chips will start even Intel. It is also known that the company now MediaTek working hard on the production of 8-core mobile processor, which can delay the release of the 64-bit version a few months, but anyway it will probably happen in the second half of 2014
In short, almost certainly 2014 will be a year of 64-bit mobile processors.
Plans of Intel processor division are no less ambitious, more so in 2014 a giant need to present a new architecture codenamed Broadwell. As might be expected, it would be particularly optimized for use in various types of mobile computers, which brings both high performance CPU and GPU, and a considerably lower power consumption. Broadwell family of products is expected in the second half of the year, so it is still early to talk about any specific model numbers and specifications, but the Internet has already leaked some preliminary data that allow you to make a brief summary of some of the most important details of these processors.
Expected that the first of the new mobile processors Broadwell family are divided into three series with designations "H", "U" and "Y". H-series will consist of high-performance processors available as one-and two chips platforms. The second will be equipped with four CPU cores, GT3e or GT2 graphics and up to 6 MB of last level cache. It is expected that these chips have support DDR3L-1600 memory and TDP (Thermal Design Power) rating of 47 W, although some models can be written in 37-watt range. Broadwell H-series processors will be fitted with HM86, HM87 and QM87 Haswell chipset, and a new system set HM97.
Chips "U" and "Y" series will be energy-saving systems on a chip (SoC), equipped with two CPU cores and 4 MB cache in the third level. "U" models will support up to 16 GB of RAM type DDR3L-1600 or 8 GB one type LPDDR3-1600, TDP and their ratings will be 15 and 28 W. 15-watt Core branded processors will have the GT3 and GT2 integrated graphics, while that of Celeron and Pentium their options will be limited to GT1 GPU. 28-watt chips from this series will be equipped with GT3 graphics core and will wear the familiar markings Core i3, Core i5 and Core i7.
Perhaps the most interesting of the Broadwell family will ultraenergoikonomichnite SoC processors "Y" line. Their thermal power will not exceed 4.5 watts, and some will even have a 3,5 W TDP. It is expected that these chips have two cores, GT2 GPU and up to 4 MB of level three cache. Broadwell "Y" processors will work with LPDDR3-1600 memory and supports up to 8 GB RAM.
Of course, Broadwell CPUs will not be the only technological innovation that Intel intends to present year. The company has plans for significant innovation and its SSD products, as well as other "areas of interest" that were briefly summarized for you, the readers of PC World, Manuel Chugudean, PR manager of Intel's Central and Eastern Europe (CEE).
Chips "U" and "Y" series will be energy-saving systems on a chip (SoC), equipped with two CPU cores and 4 MB cache in the third level. "U" models will support up to 16 GB of RAM type DDR3L-1600 or 8 GB one type LPDDR3-1600, TDP and their ratings will be 15 and 28 W. 15-watt Core branded processors will have the GT3 and GT2 integrated graphics, while that of Celeron and Pentium their options will be limited to GT1 GPU. 28-watt chips from this series will be equipped with GT3 graphics core and will wear the familiar markings Core i3, Core i5 and Core i7.
Perhaps the most interesting of the Broadwell family will ultraenergoikonomichnite SoC processors "Y" line. Their thermal power will not exceed 4.5 watts, and some will even have a 3,5 W TDP. It is expected that these chips have two cores, GT2 GPU and up to 4 MB of level three cache. Broadwell "Y" processors will work with LPDDR3-1600 memory and supports up to 8 GB RAM.
Of course, Broadwell CPUs will not be the only technological innovation that Intel intends to present year. The company has plans for significant innovation and its SSD products, as well as other "areas of interest" that were briefly summarized for you, the readers of PC World, Manuel Chugudean, PR manager of Intel's Central and Eastern Europe (CEE).
Next Generation Graphics - NVIDIA Maxwell
The new generation of AMD GPUs is a fact of the last quarter of 2013, and on January 6, 2014 and NVIDIA present perhaps the last incarnation of its proven graphics architecture practice Kepler - its mobile adaptation in the face of the latest processor Tegra SoC K1. However, this ecosystem Kepler acquires finished in the new year comes time for your next GPU architecture "green."
Typical of GPU codenamed Maxwell is that he will be the first GPU chip produced 20-nanometer process technology in the facilities of TSMC. After Fermi chips were produced on 40-nanometer technology and Kepler - a 28-nanometer, it is logical Maxwell to continue the trend and thanks to a new process to provide more performance while consuming less power.
This, of course, is within the normal and expected. What really distinguishes architecture from previous Maxwell is embedded 64-bit ARM processor. This is something that NVIDIA has been working for years, and the idea is simple and known again by Tegra chips - have a core group that caters to the general, neresursoemki tasks so as to reduce the total consumption of the chip. Another important innovation in Maxwell graph will be called. Unified Virtual Memory (unified virtual memory). Under that name actually lies opportunity GPU and CPU hybrid chip modules share a common memory system - in other words, analogue hUMA decision of AMD. It is amazing how the graphics and computing processors are starting to look alike. Sometime this year will see another illustration of this fact in the face of Maxwell.
This, of course, is within the normal and expected. What really distinguishes architecture from previous Maxwell is embedded 64-bit ARM processor. This is something that NVIDIA has been working for years, and the idea is simple and known again by Tegra chips - have a core group that caters to the general, neresursoemki tasks so as to reduce the total consumption of the chip. Another important innovation in Maxwell graph will be called. Unified Virtual Memory (unified virtual memory). Under that name actually lies opportunity GPU and CPU hybrid chip modules share a common memory system - in other words, analogue hUMA decision of AMD. It is amazing how the graphics and computing processors are starting to look alike. Sometime this year will see another illustration of this fact in the face of Maxwell.
DDR4 memory: a slow and difficult start
It sounds almost unbelievable, but widely used in today's computers DDR3 memory are seven years. In the world of computer technology that's forever, so definitely time to upgrade that needs to happen exactly in 2014, at least this year the market is expected onset of the first computer systems, working with DDR4 SDRAM memory. In 2014 tryabvalo would be available first processors supporting such RAM - CPU chips for high desktops Intel Haswell-E and system chip AMD Hierofalcon, for incorporation into a variety of industrial devices. A little later on platforms that support prospective memory in question will join and server solutions. For widespread DDR4 SDRAM memory but can only be expected when Intel started shipping its 14-nanometer processors Skylake, as they will be the first truly mainstream CPU devices with support for the new RAM. This means that the transition from DDR3 to DDR4 may be delayed like the transition from DDR2 to DDR3. However, there are indications that the implementation of the new memory can become even more difficult.
So believe in analytical company IHS, which last week published its latest forecast for the prospects of DDR4 SDRAM memory. According to the authors of the document from the first appearance of PC systems with support for DDR4 until the new memory begins to dominate the market over DDR3, it will take at least two years. Moreover, in the first year and a half, the proportion of DDR4 products to more than three times smaller than that of DDR3 products as initially relatively few systems will support the modern standard. In other words, according to HIS active interest DDR4 SDRAM memory can occur as early as the third quarter of 2015, and it provided they do not experience any problems and delays in deliveries of processors Intel Skylake, which must replace Broadwell chips (which you will come after the current Haswell).
So believe in analytical company IHS, which last week published its latest forecast for the prospects of DDR4 SDRAM memory. According to the authors of the document from the first appearance of PC systems with support for DDR4 until the new memory begins to dominate the market over DDR3, it will take at least two years. Moreover, in the first year and a half, the proportion of DDR4 products to more than three times smaller than that of DDR3 products as initially relatively few systems will support the modern standard. In other words, according to HIS active interest DDR4 SDRAM memory can occur as early as the third quarter of 2015, and it provided they do not experience any problems and delays in deliveries of processors Intel Skylake, which must replace Broadwell chips (which you will come after the current Haswell).
However, there is a problem and it is rooted in the fact that the market for memory circuits were only three major players: companies Samsung Electronics, Micron and SK Hynix. A competition between them is particularly acute, as years ago. This gives rise to HIS analysts to predict that at least until the end of 2015 DDR4 SDRAM memory will remain "a premium", ie very expensive proposition.
According to representatives of HIS shared last week at the forum IDF 2013, the price of 8 GB DDR4 modules will be at $ 90 when they hit the market. Reducing the price to a level of $ 50 will take about three years, and the turning point when DDR4 memory will become cheaper than DDR3, will occur until the beginning of 2016
New and faster USB
USB 3.0 interface gradually gets more and more common and will eventually replace the second generation. Meanwhile, the organization USB 3.0 Promoter Group has begun work on additions to SuperSpeed USB specifications that will make the interface double faster. This fact became clear during last year's Consumer Electronics Show CES 2013, within which the USB 3.0 Promoter Group promised new standard, providing double the data transfer rate (10 Gb / s) compared to the current 5-Gigabit USB 3.0.
By the USB 3.0 Promoter Group also promised that the improved USB 3.1 version will be compatible with existing cables and connectors, as well as deployed software and today's communication protocols. Another good news is that the updated specifications of the USB interface accelerations are ready, they are already there and the first demos of the new standard. The first tests show them transfer speeds of around 800 MB / s, but with the recent adjustments could easily be expected in the coming months to see and USB buses, providing speeds of 1 GB / s and up.
New and faster USB
USB 3.0 interface gradually gets more and more common and will eventually replace the second generation. Meanwhile, the organization USB 3.0 Promoter Group has begun work on additions to SuperSpeed USB specifications that will make the interface double faster. This fact became clear during last year's Consumer Electronics Show CES 2013, within which the USB 3.0 Promoter Group promised new standard, providing double the data transfer rate (10 Gb / s) compared to the current 5-Gigabit USB 3.0.
By the USB 3.0 Promoter Group also promised that the improved USB 3.1 version will be compatible with existing cables and connectors, as well as deployed software and today's communication protocols. Another good news is that the updated specifications of the USB interface accelerations are ready, they are already there and the first demos of the new standard. The first tests show them transfer speeds of around 800 MB / s, but with the recent adjustments could easily be expected in the coming months to see and USB buses, providing speeds of 1 GB / s and up.
Meanwhile, late last year it became clear that standards organization develops and another new version of the popular interface, which according to the information available will be compatible with existing connectors.
The idea here is another: to increase the convenience of using the USB interface. For this purpose, experts believe to implement new Type-C connector that will be compact and bilateral. Owing to the second feature of the connector can be included on both sides, i.e., orientation relative to the port will be of no importance, and could also be used in a thinner mobile.
So far standardization organizations do not provide images of the new USB Type-C connector and other details. It is only known that he will maintain the specification USB 3.1, and its dimensions are comparable to Micro USB. Planned development of the new connector should be completed by mid-2014 and, so stay tuned for more details on this topic in about half a year. The first products with the new connector, however, is likely to hit the market until 2016
SATA Express storage devices
Transfer possibilities Interface SATA 6 already severely tested by the modern, fast and increasingly popular semiconductor (SSD) drives. For many users, the speed of data transfer, display of SSD devices are the maximum that they can imagine. However, this is not true - a new SATA standard promises much more with transfer speeds of the order of 1,4 GB / s.
The idea here is another: to increase the convenience of using the USB interface. For this purpose, experts believe to implement new Type-C connector that will be compact and bilateral. Owing to the second feature of the connector can be included on both sides, i.e., orientation relative to the port will be of no importance, and could also be used in a thinner mobile.
So far standardization organizations do not provide images of the new USB Type-C connector and other details. It is only known that he will maintain the specification USB 3.1, and its dimensions are comparable to Micro USB. Planned development of the new connector should be completed by mid-2014 and, so stay tuned for more details on this topic in about half a year. The first products with the new connector, however, is likely to hit the market until 2016
SATA Express storage devices
Transfer possibilities Interface SATA 6 already severely tested by the modern, fast and increasingly popular semiconductor (SSD) drives. For many users, the speed of data transfer, display of SSD devices are the maximum that they can imagine. However, this is not true - a new SATA standard promises much more with transfer speeds of the order of 1,4 GB / s.
These are the works since 2011 standard SATA Express. It is characterized by a combination of SATA software infrastructure with interface PCI Express (PCIe), which allows the development of a new type of SATA compatible storage devices using PCIe connectors. In this way, technology will increase maintained by those devices transfer rate up to 8 Gb / s or 16 Gb / s - if you use a PCI Express 3.0, support for which is already happening in the motherboard of all the major manufacturers in this segment.
Well, SATA Express specification has been completed by the end of the current year will most likely see the market and the first based on its storage devices. Unlike traditional hard drives and SSD products they will not come in the usual 2.5-inch or 3.5-inch format for storage devices and will resemble more of M.2 memory modules used in some of the modern laptops . In short, this year looks set to see another good reason to abandon the archaic mechanical hard drives and replace them with faster and SSD storage systems. Of course, this will only happen if the price of the last get closer to the value of HDD space.
The new G-Sync monitors
At the end of last year NVIDIA offer an interesting solution for visualization, called G-Sync, which puts GPU processors directly to the playback screen and virtually eliminate entirely any sync issues between the video footage and monitor. That takes care of that new technology of NVIDIA, realized in the form of a separate board for incorporation into monitors gaming class.
Well, SATA Express specification has been completed by the end of the current year will most likely see the market and the first based on its storage devices. Unlike traditional hard drives and SSD products they will not come in the usual 2.5-inch or 3.5-inch format for storage devices and will resemble more of M.2 memory modules used in some of the modern laptops . In short, this year looks set to see another good reason to abandon the archaic mechanical hard drives and replace them with faster and SSD storage systems. Of course, this will only happen if the price of the last get closer to the value of HDD space.
The new G-Sync monitors
At the end of last year NVIDIA offer an interesting solution for visualization, called G-Sync, which puts GPU processors directly to the playback screen and virtually eliminate entirely any sync issues between the video footage and monitor. That takes care of that new technology of NVIDIA, realized in the form of a separate board for incorporation into monitors gaming class.
Another positive effect of the use of G-Sync is the release of computing resources, says another official information from NVIDIA. I.e. after playback smooth movie now not needed much higher frame rate, the available GPU power can be redirected to playing the higher quality graphics.
It is not entirely clear how many will eventually raise the price of the monitor using the technology NVIDIA G-Sync, but according to the corporate marketing director of the company Youdjel Desai (Ujesh Desai) appreciation will be greater. (It is important to know, however, that the additional module to work, it must be used with card NVIDIA GeForce architecture Kepler.)
According to available information, several major manufacturers of monitors such as ASUS, BenQ, Philips and ViewSonic plan to begin production of gaming monitors with G-Sync technology NVIDIA's still in the first quarter of 2014 This means that you will not wait long for a new perfect gaming monitors. Директория за български интернет сайтове .
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